The Role of RE & FA
RE&FA at Kaynes Semicon governs device reliability validation and structured failure intelligence across semiconductor programs.
The division owns accelerated stress strategy, failure mechanism identification, and systemic reliability feedback into packaging, silicon validation, and manufacturing environments.
Core Domain
RE & FA defines how devices behave under long-term electrical, thermal, and environmental stress and how failure modes are isolated and eliminated.
- Reliability Engineering
- Failure Analysis
- Reliability Intelligence & Production Feedback
- Technical Infrastructure
High Temperature Operating Life (HTOL) strategy development
Temperature cycling and thermal shock evaluation
Highly Accelerated Stress Testing (HAST)
Power cycling validation for SiC and IGBT devices
AEC-Q stress condition alignment and qualification modelling
Electrical fault isolation and curve-trace diagnostics
Cross-section analysis of interconnect and die-attach failures
SEM / EDX material inspection workflows
Package-induced stress fracture identification
Wirebond lift and solder joint fatigue analysis
Failure mode taxonomy development
Yield excursion root-cause integration
Field-return analysis and corrective action modelling
Screening optimisation based on stress results
Semiconductor-grade reliability stress environments
Thermal cycling and high-temperature evaluation chambers
Failure analysis lab capabilities for electrical and physical diagnostics
Integrated reliability review workflows across engineering and manufacturing