Committed to excellence in semiconductor manufacturing, our mission is to be the go-to provider for cutting-edge packaging and testing solutions. We strive to exceed industry standards, elevate customer satisfaction, and contribute to the success of our customers.
CHAIRPERSON
Hence the R&D line for OSAT in co-packaged optics space and a system for networking domain will be a true silicon-to-system from Kaynes Semicon.
Managing Director
We will bring experienced OSAT leaders from southeast Asia and Taiwan, and create an ecosystem of trained engineers, operators and technicians for India.
SENIOR VICE PRESIDENT - ENGINEERING
Our Test Roadmap and CapEx spending will cover Analog, Digital Mixed Signal, RF, Power, Memory and modules which will allow Kaynes to test from legacy packages to advance 3D and SiPh packages.
HEAD OF R&D
Joining Kaynes Semicon in its foundational phase in 2024 means being part of something truly exciting. We're not just building a facility; we're architecting a global leader in advanced packaging from the ground up. Our R&D is laser-focused on mastering and advancing the innovative technologies, including 2.5D/3D integration, chiplet strategies, and other cutting-edge packaging solutions, that will define that leadership.
HEAD OF NEW BUSINESS
At Kaynes Semicon, we are not just building facilities, we are building futures. By integrating global expertise with local talent, we aim to position India as a strategic hub for OSAT services and advanced semiconductor manufacturing.
Subsidiary of Kaynes Technology India Ltd
Kaynes Semicon Private Limited,
Industrial Area II, Sanand, Gujarat
PIN : 382170
Copyright © 2023 Kaynes Semicon. All Rights Reserved.
Developed by: InsideOut Consult
Subsidiary of Kaynes Technology India Ltd
Kaynes Semicon Private Limited,
Industrial Area II, Sanand, Gujarat
PIN : 382170
Copyright © 2023 Kaynes Semicon. All Rights Reserved.
Developed by: InsideOut Consult
