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    Semicon News

    India’s First MEMS Microphone Launched by Kaynes Semicon and Infineon, Marking a Milestone in Innovation

    By KaynesSemiconJanuary 6, 2026February 23rd, 2026No Comments

    KaynesSemicon

    KaynesSemicon

    • Previous PostKaynes Semicon’s System Solutions Group (SSG) new office at HSR Layout, Bangalore marking a new milestone

    • Next PostHon’ble Minister Ashwini Vaishnaw Visits Kaynes Semicon Facility, Showcasing India’s Semiconductor Growth

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    • About
      • Why Kaynes Semicon Exists
      • Vision
      • Mission
      • Leadership & Management
      • Manufacturing & Plant Footprint
    • Engineering Domains
      • Research & Development
      • Outsourced Semiconductor Assembly & Test
      • Post-Silicon Engineering
      • Reliability Engineering & Failure Analysis
      • Systems Solutions Group
      • Original Design Manufacturer
    • Packages & Products
      • Packaging Platforms
        • Quad Flat No-leads (QFN) Packages
        • Small Outline Transistor (SOT) Packages
        • Transistor Outline (TO) Packages
      • Semiconductor Modules
        • Ball Grid Array (BGA) Packages
        • Flip Chip Ball Grid Array (FCBGA)
        • Flip Chip Chip Scale Package (FCCSP)
      • Test & Validation
        • Multi-Chip Module (MCM)
        • System in Package (SiP)
        • Co-Packaged Optics (CPO)
    • Ecosystem
      • Building Capability
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