Designation: Senior Equipment Engineer – OSAT (Assembly & Advanced Packaging)
Department:Equipment Engineering / Assembly Manufacturing
Reporting To:
- Primary Reporting: Equipment Engineering Manager / Director
- Functional Reporting: Manufacturing / Process Engineering / NPI–NPD / Quality (as applicable)
Role Summary:
- Responsible for the technical ownership, reliability, availability, compliance, and cost effectiveness of semiconductor assembly equipment supporting conventional, automotive, and advanced packaging technologies.
- The role spans the full equipment lifecycle, including tool installation, advanced troubleshooting, preventive and predictive maintenance, steady-state manufacturing sustainment, and continuous improvement.
- The incumbent ensures automotive-grade robustness, optimized Cost of Ownership (CoO), and compliance with IATF 16949, ISO standards, and OSHA / EHS requirements, supporting both NPI and high-volume production.
Equipment & Process Scope (OSAT – Assembly)
OSAT Processes – Die Attach, Wire Bond (Au, Cu, fine-pitch, multi-row), Stacked-Die Attach & Wire Bonding, Chip-on-Board (COB) Assembly, Flip Chip & Hybrid Assembly, Mold / Transfer Mold / Compression Mold, Tin Plating Lines, Singulation, Optical Inspection Systems (2nd Opt, 3rd Opt, FVI), Supporting equipment (curing ovens, loaders/unloaders, material handling)
OSAT, Automotive & Advanced Packages
Power Modules, QFN / DFN, BGA / LGA, FC-BGA / FC-CSP, WLCSP, MEMS, Stacked-Die Packages, SoC-based packages (logic-centric, automotive and industrial), COB (Chip-on-Board) modules, SiP (System-in-Package), 2D, 3D, Photonics, Automotive-grade and high-reliability packages, Thin packages and warpage-sensitive designs
Key Responsibilities
Equipment Engineering & Technical Ownership
- Own technical performance, robustness, and long-term health of assigned equipment platforms
- Support equipment Factory Acceptance Test, Site Acceptance Test, installation, qualification, and production release
- Ensure equipment capability supports stacked die, SoC, COB, and advanced package requirements
- Maintain complete equipment documentation, change records, and audit evidence
Troubleshooting & Corrective Maintenance
- Perform deep-level troubleshooting across mechanical, electrical, pneumatic, vacuum, vision, PLC, and software systems
- Lead root cause analysis for downtime, yield loss, and defect generation tied to equipment behavior
- Implement permanent corrective and preventive actions
- Act as technical escalation owner for chronic, complex, or high-impact equipment issues
Preventive & Predictive Maintenance
- Develop, optimize, and sustain Preventive Maintenance (PM) programs for critical tools
- Implement Predictive Maintenance (PdM) using: Condition-based monitoring, Tool health indicators and alarm trends, Performance and degradation data
- Improve MTBF, reduce MTTR, and minimize unplanned downtime
- Ensure PM execution, traceability, and compliance with audit requirements
Equipment Risk Management & EFMEA
- Develop, maintain, and deploy Equipment FMEA (EFMEA) for assembly equipment
- Align EFMEA with PFMEA, Control Plans, and IATF 16949 requirements
- Support internal, customer, and automotive audits
Cost of Ownership (CoO) & Lifecycle Management
- Drive Cost of Ownership optimization, including: Spare parts strategy and critical inventory planning, Consumables and wear-part reduction
- Maintenance labor and downtime cost control
- Manage equipment lifecycle planning, technology upgrades, and obsolescence risk
- Engage vendors on performance improvement and long-term cost reduction
Automotive, Compliance & Cross-Functional Support
- Support NPI and ramp-up for automotive, SoC, stacked-die, and COB products
- Ensure equipment practices comply with: IATF 16949 automotive quality requirements, ISO quality and environmental standards (ISO 9001, ISO 14001, as applicable), OSHA, EHS, and local safety regulations
- Participate in internal audits, customer audits, and certification assessments
- Collaborate with Process Engineering, Quality, Manufacturing, and EHS teams
- Support operator and technician training with strong safety and compliance focus
Equipment Engineering Methodologies & Tools
- Equipment FMEA (EFMEA)
- Root Cause Analysis (5-Why, Fishbone, Fault Tree)
- Preventive & Predictive Maintenance methodologies
- Reliability engineering (MTBF, MTTR, failure trend analysis)
- Cost of Ownership (CoO) analysis
- Change management and risk assessment
- Data-driven analysis using alarms, downtime, and condition trends
Key Performance Indicators (KPIs)
- Equipment availability / uptime (%)
- Mean Time Between Failure (MTBF)
- Mean Time To Repair (MTTR)
- Preventive maintenance compliance (%)
- Equipment-related downtime impact to production
- Cost of Ownership (CoO) improvement
- Safety, audit, and compliance findings (zero-target)
Qualifications
- Bachelor’s Degree in Engineering (Mechanical, Electrical, Electronics, Mechatronics, Automation, or related field)
AND - Minimum 5 years of in-depth equipment engineering experience in OSAT or semiconductor manufacturing, including: Advanced troubleshooting, Preventive and predictive maintenance systems, Equipment FMEA (EFMEA), Cost of Ownership (CoO) management
- Experience supporting stacked-die, SoC, and COB assembly is strongly preferred
- Exposure to automotive semiconductor manufacturing (IATF 16949)
- Strong understanding of ISO quality systems and OSHA / EHS compliance
- Ability to interpret schematics, diagnostics, and complex equipment controls
- Strong analytical, problem-solving, and cross-functional communication skills
Role Level
This role may be designated as Equipment Engineer or Senior Equipment Engineer based on experience depth, advanced package exposure, automotive program involvement, and NPI ownership.