India’s Silicon Ambition: Prime Minister Modi to Inaugurate Kaynes Semicon’s Landmark Gujarat Facility
SANAND, GUJARAT 24/3/2026 — In a move set to redefine India’s standing in the global high-tech landscape, Prime Minister Narendra Modi along with Gujarat CM and Union Ministers will travel to Sanand on March 31, 2026, to officially open Kaynes Semicon’s premier semiconductor backend facility.
The visit marks a dual milestone for the nation: the inauguration of a state-of-the-art Outsourced Semiconductor Assembly and Test (OSAT) campus and the unveiling of the company’s first indigenously assembled semiconductor product.
The facility, a subsidiary of Kaynes Technology India Limited, represents a massive investment exceeding INR 33.07 Billion. It stands as a testament to the country’s growing self-reliance in a sector typically dominated by global giants, serving as India’s first integrated semiconductor backend platform.
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Beyond the machinery and the cleanrooms, the Sanand facility is being hailed as a catalyst for human and industrial progress. Designed to support critical sectors—ranging from the vehicles Indians drive to the telecommunications and AI systems that power their daily lives—the facility represents a new chapter for Indian engineering talent.
Raghu Panicker, CEO of Kaynes Semicon, characterized the upcoming inauguration as a “defining milestone” for the nation’s technological journey.
“This facility brings together advanced packaging, assembly, testing, and reliability capabilities under one roof — built to global standards and powered by Indian engineering talent,”
Panicker stated “We are deeply honoured that the Hon’ble Prime Minister will dedicate this landmark facility to the nation.”.
Powering the Future
The Sanand campus is more than an industrial site; it is a cradle for Indian ingenuity. Within its walls, local engineers will transform raw silicon into the “brains” of the future, crafting chips that will power everything from everyday vehicles to critical defense systems. By mastering complex packaging and reliability engineering, these workers ensure that Indian-made technology meets the world’s most rigorous standards as mass production begins in 2026.
As the global community seeks more resilient supply chains, this facility cements India’s role as a trusted and competitive partner. For the team at Kaynes Semicon, the Prime Minister’s visit on March 31 represents a profound validation of their skill. It is a signal to the world that the next generation of global electronics is no longer just a foreign import—it is being built, tested, and perfected by Indian hands on Indian soil.
Event Summary
Event: Kaynes Semicon’s OSAT opening ceremony & India’s first MULTI CHIP MODULE Launch
Date: 31 March 2026.
Location: Kaynes Semicon Campus, Sanand, Gujarat.
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