Silicon Characterisation & Test Architecture Engineering
PSE at Kaynes Semicon defines how silicon behaviour is characterised, validated, and translated into scalable production test environments.
The division owns post-silicon device analysis, test program architecture, and wafer-to-package correlation across performance, coverage, and throughput conditions.
Core Domain
PSE governs how silicon behaves under real electrical, thermal, and operational stress and how that behaviour is measured at scale.
- Device Characterisation
- Test Architecture Engineering
- Correlation & Data Discipline
- Technical Infrastructure
Parametric drift analysis across temperature corners
Leakage and breakdown behaviour modelling
Timing and signal integrity validation
Power switching behaviour profiling for SiC, GaN, and IGBT devices
RF gain and noise performance characterisation
ATE program development and vector optimisation
Coverage modelling against defect density assumptions
Test time reduction without coverage compromise
Parallelism and multisite throughput optimisation
Adaptive test strategy design
Wafer sort to final test correlation analysis
Guard-band definition based on silicon behaviour
Yield learning integration across test stages
Data-driven screening logic refinement
Advanced ATE development platforms across mixed-signal, power, and RF domains
Structured silicon validation workflows
Data analytics integration for correlation and yield modelling
Cross-functional alignment with packaging and reliability engineering