Packaging Technology & Process Engineering
R&D at Kaynes Semicon advances backend semiconductor packaging technologies and assembly process capability.
The division focuses on packaging architecture development, materials behaviour under stress, and process platform engineering to expand long-term manufacturing capability.
Core Domain
R&D owns the technical evolution of packaging structures and assembly methodologies.
- Packaging Architecture Engineering
- Materials & Interconnect Engineering
- Process Platform Development
- Engineering Infrastructure
Flip-chip interconnect architecture design
Multi-die stacking configuration development
System-in-Package layout optimisation
Substrate and interposer selection strategy
Solder alloy evaluation and joint reliability modelling
Underfill material behaviour under thermal cycling
Die-attach parameter optimisation
Warpage and interconnect stress analysis
Wirebond parameter envelope optimisation
Mould compound flow and void control studies
Reflow and curing profile validation
Design-for-manufacturability rule definition
Dedicated development lines for pilot builds
Controlled thermal and stress evaluation environments
Structured process validation workflows
Integrated review cycles with reliability and manufacturing teams